DOTSLASER, a leading provider of laser technology solutions, is proud to announce its focus on R&D in the rapidly developing field of micromachining utilizing ultrafast laser systems. This strategic focus positions the company at the forefront of driving next-generation manufacturing in high-tech industries.
The growing demand for smaller, more powerful, and more efficient components in fields such as medical devices, semiconductors, consumer electronics, and new energy requires micro-machining capabilities. Traditional manufacturing technologies often reach their physical limits and struggle to cope with issues such as heat buildup, material stress, and lack of precision.
DOTSLASER recognizes this challenge and has invested significant resources in exploring the enormous potential of picosecond and femtosecond laser technologies. Our research focuses on "cold ablation," which uses ultrashort light pulses to remove material with virtually no thermal impact on the surrounding area. This enables the production of extremely precise, clean, burr-free features, often smaller than the width of a human hair.
"Our investment in ultrafast laser research is a direct response to our customers' future needs," said Dr. Li. "We are not only committed to applying this technology, but also delving deeply into its fundamental principles and pushing the boundaries of what is possible. Our goal is to solve complex micromachining challenges – from creating fine structures on brittle materials to processing heat-sensitive thin films – with unparalleled precision and quality."
Key areas of research being pursued by the DOTSLASER R&D team include:
Ultrafine micromachining: Achieving feature sizes in the single-digit micrometer range on a variety of substrates, including metals, ceramics, polymers, and glass.
Surface structuring: Creating precise microtextures and patterns to modify surface properties for applications such as hydrophobicity, friction reduction, and optical diffusion.
Thin-film patterning: Cleanly removing thin conductive and semiconducting layers without damaging the underlying material, which is critical for flexible electronics and display technologies.
Process optimization: Developing customized parameters for specific material-application combinations to maximize throughput, quality, and yield.
This research program has already yielded encouraging results, with several proprietary technologies moving from the lab to pre-production validation with industry partners.
"DOTSLASER's research in this area is crucial," said a representative from a partner company in the medical device field. "Their expertise in ultrafast laser applications is helping us design and prototype innovative minimally invasive devices that were previously impossible to manufacture."
By deepening its expertise in ultrafast laser microprocessing, DOTSLASER strengthens its commitment to providing not only advanced equipment, but also the fundamental knowledge and process support to enable its customers to innovate.
To learn more about DOTSLASER's research capabilities and laser solutions, please visit our website or contact our technical team.
About DOTSLASER:
DOTSLASER is a leading provider of high-performance laser marking, cutting, and micromachining solutions. With a strong focus on innovation and quality, the company serves customers across a wide range of industries worldwide, providing advanced technology, reliable support, and deep application expertise to drive manufacturing excellence.
